QINFENG Launches Enhanced One-Piece Welded Butterfly Valve Series for AI Data Center Liquid Cooling

Jun 15,2026
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New Valve Series Addresses Zero-Leakage Requirements in High-Density Racks

As AI server racks push power densities beyond 50kW, liquid cooling system operators face increasing pressure to eliminate every potential leak path. Qinfeng Technology has released its enhanced one-piece welded butterfly valve series, designed specifically for the secondary side of cold-plate liquid cooling loops. The new series features an integrated welded body that removes flange bolts — a common source of external leakage in traditional valve designs.

Technical Upgrades That Matter for 24/7 Operation

The enhanced series introduces triple stem sealing and a patented anti-leak structure that contains fluid within the stem chamber even under abnormal pressure conditions. Unlike conventional valves where liquid may escape through both stem and body joints, the Qinfeng design limits any potential seepage to a non-critical cavity. The valve also supports in-line maintenance: technicians can close the valve, remove a single flange and repair branch piping without draining the main cooling loop or shutting down servers. Independent cycle testing has verified over 100,000 open-close operations without external leakage.

Available in Multiple Configurations

The enhanced butterfly valve series is available in sizes DN50 to DN150 (2" to 6"), with manual, pneumatic and electric actuator options. End connections include weld ends, clamp fittings and flanges, allowing integration with common liquid cooling distribution headers and rack-level manifolds. All valves are degreased and optionally electropolished to meet the cleanliness requirements of data center coolant loops.

Supporting Documentation

For each valve, Qinfeng provides EN 10204 3.1 material certificates, helium leak test reports (leak rate <1×10⁻⁹ Pa·m³/s), and pressure test certificates. Customers may request factory acceptance testing witnessed by third-party inspectors.

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